Philips Semiconductors

Description

Introduction. This Logic Cross-Reference for Buyers, Distribution Specialists and others with an interest in Logic will assist in finding a device made by Texas Aug 13, 2009 plastic shrink small outline package; 20 leads; body width 5.3 mm. SOT339-1. 74LVCH244ADB. 74LVC244APW . 40 C to +125 C. TSSOP20. 74LVC244AT20-13. Octal Buffer/Line Driver with 3 State Outputs. TSSOP-20 TC74LCX244FT. SN74LVC244APWR. 74LVC244APW MC74LCX244DTR2G. Die Pad Size (mm). 2.40x2.70. 2.75x4.00. Die Size (mm). 0.82x0.90. 1.36x1.45. Vehicle name. 74LVC244APW . 74LVC574APW. Subpack old. SOT360CC2. 4.7K. 0402_CC. R331. 4.7K. 0402_CC. C187 0.1UF16V0402_CC. U21. 74LVC244APW . 1A0. 2. 1A1. 4. 1A2. 6. 1A3. 8. 2A3. 11. 2A2. 13. 2A1. 15. 2A0. 17. 1OE.