Philips Semiconductors

Description

Datasheet Apr 22, 2004 in TSSOP32 (UDA1380TT) and HVQFN32 ( UDA1380HN ) packages. refers to both UDA1380TT and UDA1380HN , unless particularly 1. Introduction. Lead frame(Copper Alloy). IC (Silicon)Die Attach (Epoxy). Lead frame Die Pad (or thermal pad). Exposed At Base of the Package. J12. SJ3524-SMT. 1. 2. 3. 4. R45. 0. R45. 0. R85. 10K. R85. 10K. J16. SJ3524- SMT. J16. SJ3524-SMT. 1. 2. 3. 4. U3. UDA1380HN . U3. UDA1380HN . VINR. 29. Jun 30, 2015 30-jun-2016. UDA1380HN /N2,118 935271001118. UDA1380HN /N. 2. SSA CODEC. SOT617-1 HVQFN32 full withdrawal. Standard end- of-life. VINR. WSO. BCKO. VDDD. VSSD. VSSA_HP. VSSA_DA. VDDA_HP. VDDA_DA. VDDA_AD VSSA_AD. VREF. VREF_HP. PGND. U15. UDA1380HN . G1. 18. 25.